BUSINESSES

BN Solutions

BUSINESSES BN Solutions

BN (Boron Nitride) is one of the quintessential heat-dissipating particles.

It boasts excellent heat and corrosion resistance, a low coefficient of thermal expansion, and high thermal conductivity, making it a primary filler in materials requiring high thermal conduction.

The most fundamental form of BN particles is platelet-shaped, commonly referred to as h-BN (hexagonal Boron Nitride).

The high aspect ratio and surface area of h-BN (hexagonal-Boron Nitride) due to its platelet structure can pose challenges in various processes.

To overcome this, numerous companies have manufactured h-BN agglomerates to address issues of anisotropy.

However, the agglomerates' weak strength often leads to breakage at high fill levels, introducing further complications.

WiLCO BN Solutions has been developed leveraging WiLCO’s proprietary technology to overcome these challenges and maximize the value of BN. We provide specially treated BN particles in various sizes and shapes to enhance performance and application potential.

WiLCO's ABNC (Agglomerated Boron Nitride Composite) exhibits superior thermal conductivity, insulation, and dielectric properties, making it predominantly used in the manufacturing of high-temperature electronics and high-frequency components.

ABNC enhances thermal management in polymer composites such as CCL (Copper Clad Laminate) included in PCBs (Printed Circuit Boards) and TIMs (Thermal Interface Materials).

With its low dielectric constant and loss, ABNC is an ideal choice for products operating in high-frequency ranges. It is particularly gaining attention in the aerospace industry, where high-performance electromagnetic characteristics are essential.

Contact Information

  • Jeong JuhoCore Technology Development Team
  • juho.jeong@wilco.co.kr
  • 070-8648-3073
  • 070-4833-3073