WILCO, a leading startup in advanced electronic materials, has been selected for the Ministry of SMEs and Startups’ “Deep Tech Link-Up Program” in the future mobility sector, following its earlier selection for the “Deep Tech Startup 1000+” initiative.

As part of the Link-Up Program, WILCO will collaborate with global automotive tier-1 supplier Continental AG, which serves as the anchor company. This partnership grants WILCO the opportunity to validate its high-thermal conductivity paste and low-Dk CCL materials through a full PoC (proof-of-concept) process, including assessment for mass production readiness.

WILCO has independently developed CCL solutions optimized for high-frequency and high-speed communication environments, offering dielectric constants below 3.5 and thermal conductivity exceeding 2.0 W/mK. Through the collaboration with Continental, the company aims to position its materials as reliable solutions for automotive HUDs, high-performance computing, and radar modules.

CEO Sangwon Park commented, “By localizing CCL materials previously reliant on expensive imports, we are building cost competitiveness and supply chain independence within the domestic automotive electronics sector. Our partnership with Continental is a pivotal step toward mass production and global expansion.”