WILCO Co., Ltd. (CEO Park Sang-won) announced on the 22nd that it has successfully secured investment from the Korea Credit Guarantee Fund (KODIT). This bridge investment follows the funding received from Daekyo Investment in May.

Founded in 2021, WILCO is developing printed circuit board (PCB) substrate materials—specifically copper-clad laminates (CCL)—applicable to satellite communications and Korean defense (K-defense) systems. The CCLs developed by WILCO serve as raw materials for PCBs, which are used as essential communication components in satellite and antenna systems.

WILCO has recently completed the establishment of large-area mass production facilities and has begun mass-producing substrates measuring 610 x 457 mm, the standard size for global distribution. This marks a significant advancement from their previous lab-scale production limited to A4-sized substrates.

"By the end of this year, WILCO plans to secure industry references by supplying low-dielectric CCL substrates to domestic industry-academic institutions," said CEO Park Sang-won. "Ensuring supply stability in the domestic satellite and defense markets is crucial, and we aim to achieve this by localizing low-dielectric CCLs, which currently have a high dependence on imports."

Since 2022, WILCO has been developing thermal runaway mitigation materials for electric vehicles and is set to apply them in mass-produced EVs by the end of this year.